2026 Impact Factor
2.2
Released June 2026 · Based on 2025 citation data
↓ 0.1 (-4.3%) vs last year
Metric year 2025
Released
Metric year 2024
| Category | Indexes | Quartile |
|---|---|---|
| ENGINEERING, ELECTRICAL & ELECTRONIC | SCIE | Q3 |
| ENGINEERING, MECHANICAL | SCIE | Q3 |
Journal of Electronic Packaging's newest impact factor is 2.2, released June 17, 2026 and based on 2025 citation data. The journal is listed as JCR Q3 in this Journal Metrics record.
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Ranked #2,196 in Engineering by impact factor and #280 among Q3 Engineering journals. This context helps compare Journal of Electronic Packaging against journals publishing in the same field.
Published 221 papers across the last 5 recorded years with a current impact factor of 2.2.
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